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product structure: silicon monolithic integrated circuit this product has no designed protection against radioactive rays. 1/30 tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com 4.jun.2015 rev.002 serial-in parallel-out led driver 24ch constant current led driver ic with 2-line serial interface BD2808MUV-M general description BD2808MUV-M is 24ch constant current sink led driver with a high output voltage capability. this device is optimized for driving rgb leds featuring a 6bit current dac for each color. 8bit pwm control is integrated for each channel. small vqfn48mcv070 package. . features ? aec-q100 qualified (note 1) ? 2-line serial control + enable signal ? vqfn48 package ? 24 channel constant current led driver (max 50ma / channel) ? independent pwm control for each channel ? 6 bit current dac for rgb ? protection features ? equipped with pwm phase shift function to reduce emi (note1: grade 2) applications ? instrument cluster ? led status indicators ? instrument backlighting ? led interior illumination key specifications ? input voltage range: 3.0v to 5.5v ? output voltage range: 20v (max) ? dc output current (per ch): 50ma (max) ? operating temperature ra nge: -40c to +105c package w (typ) x d (typ) x h (max) vqfn48mcv070 7.00mm x 7.00mm x 1.00mm typical application circuit figure 1. typical application circuit vqfn48mcv070 bd2808muv micro- computer outg5 outr6 outb5 outb6 a4a3 outb7 vcc 3.0~5.5v vled (max=20v ) vcc xerr outg6 pgnd pgnd outr7 outg7 outr5 pgn d outb4 outg4 outr4 outb3 outg3 outr3 pgn d outb2 outg2 outr2 outb1 outg1 outr1 pgnd outb0 outg0 outr0 pgnd sdo a2 a1 a5 sdi test2 agnd clk test3 oe iset agnd vcc test1 a0 cvcc riset rxerr cvled routr0 7 routg0 7 routb0 7 fuse downloaded from: http:///
2/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pin configuration pin descriptions figure 2. pin configuration pin no. pin name functions 1 a1 device-address bit 2 a2 device-address bit 3 sdo serial data output 4 pgnd ground 5 outr0 r0 constant-current output 6 outg0 g0 constant-current output 7 outb0 b0 constant-current output 8 pgnd ground 9 outr1 r1 constant-current output 10 outg1 g1 constant-current output 11 outb1 b1 constant-current output 12 outr2 r2 constant-current output 13 outg2 g2 constant-current output 14 outb2 b2 constant-current output 15 pgnd ground 16 outr3 r3 constant-current output 17 outg3 g3 constant-current output 18 outb3 b3 constant-current output 19 outr4 r4 constant-current output 20 outg4 g4 constant-current output 21 outb4 b4 constant-current output 22 pgnd ground 23 outr5 r5 constant-current output 24 outg5 g5 constant-current output 25 outb5 b5 constant-current output 26 outr6 r6 constant-current output 27 outg6 g6 constant-current output 28 outb6 b6 constant-current output 29 pgnd ground 30 outr7 r7 constant-current output 31 outg7 g7 constant-current output 32 outb7 b7 constant-current output 33 pgnd ground 34 xerr error output 35 a3 device-address bit 36 a4 device-address bit 37 a5 device-address msb 38 sdi serial data input 39 test3 test terminal 40 agnd analog ground 41 clk serial data clock input 42 test2 test terminal 43 oe output enable 44 iset constant-current value setting 45 agnd analog ground 46 vcc power supply 47 test1 test terminal 48 a0 device-address lsb a4a3 xerr pgnd outb7 outg7 outr7 pgnd outb6 outg6 outr6 outb5 a5 outg5 sdi outr5 test3 pgnd agnd outb4 clk outg4 test2 outr4 oe outb3 iset outg3 agnd outr3 vcc pgnd test1 outb2 a0 outg2 a1a2 sdo pgnd outr0 outg0 outb0 pgnd outr1 outg1 outb1 outr2 3748 11 2 13 24 25 36 downloaded from: http:///
3/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 vcc tsd digital control 1f/10v v cc sdo vref a gnd oe vled iset pgnd a0 a1 a2 a3 a4 ? ? ? ? outr0 outg0 outb0 outr1 outg1 outb1 outr6 outg6 outb6 outr7 outg7 outb7 6bit dac 6bit dac 6bit dac pwm 8bit-log for each channel pgnd pgnd xerr a gnd osc pgnd cl k sdi i/o a5 iset pgnd pgnd test1 test2 test3 block diagram figure 3. block diagram downloaded from: http:///
4/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 description of blocks (1) power supply start-up the rise and fall time of a power supply can be from 10us to 1s. allow at least 0.1ms after v cc exceeds v uvlorise uvlo before commencing communication. input pin voltages must not exceed vcc or led flicker may occur at start-up. (2) led driver operation maximum led current can be set by selecting the value of r iset . the following formula gives the required value of r iset . _ / (typ) (3) reset power on reset occurs when v cc voltage falls below v uvlofall . software reset is by command. if reset occurs, all regi sters are cleared (set to 0) (4) protection function (xerr output) when thermal shutdown, channel open, or iset terminal short to ground are detected, the xerr terminal is pulled low. all protection functions incorporate noise rejection. the xerr terminal output is low only during detection. (latch and intentional delay time are not provided.) these signals are also written into a register. the flag returns to 0 only when the register is read. the thermal shutdown operates at 175c typically with 10c of hysteresis, release therefore occurring at 165c typically. all the channels of are turned o ff automatically when therma l shut down operates. when the r iset is out of range r isetsht, a short to ground function prevents large current from flowing into the leds. all channels of led driver are turned off automatically. a channel open is detected when v led < v lod. the individual channel is turned off automatically and v led becomes high impedance. open detection is not active if brightness is set to 0. the error flag output pin (xerr pin) is in the sa me period with the out** pin and outputs a flag. the flag stored in register retains the state once detected and is not changed until register is read. v out* v xerr register (ledopen) it returns to "0" when the register is read. vcc impossible register access possible impossible tr vcc tf vcc t acss =min 0.1ms vcc min =3.0v downloaded from: http:///
5/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 description of blocks C continued (5) led current on/off function by external pin (oe terminal) all channels can be controlled by the external pin. if oe pin is high, the led drivers are active. the internal pwm control circuit becomes asynchronous. (6) unused pins set up the test terminals and the unused terminals as follows. pin name connection reason out** short to gnd to avoid uncertain/unfixed state. (brightness setting of unused channel should be set to zero.) sdo open cmos output terminal xerr open or short to gnd open drain output terminal. when xerr is shorted to gnd, noise is avoided. oe short to vcc voltage clamp is necessary for cmos input terminal. when oe is set to low, led current is off. testx short to gnd to avoid test mode functionality. (7) led current waveform to reduce emi, the on-timing and off-timing of led are shifted in 8 groups and si multaneous on or off are avoided. the rise t r and t f fall time of the output current is also limited to further reduce emi noise. t r outr0 outg0 outb0 t f outr1 outg1 outb1 outr7 outg7 outb7 1/8 4ms 1/8 4ms figure 4. pwm phase-shift (8 groups) (8) diming function (pwm and dac diming) this ic has 2 diming functions which are pwm and dac. it is possible to set independent pwm control for each channel. dac diming is made 3 groups(r: red, g: green, b: blue). there are these detai l at page 18, 19. (9) others(vref and osc) there are vref and osc block for reference voltage and moving digital block. (10) test processing test 1-3 are pins that are used for testing. these pins are not used in normal opera tions, therefore conn ect it to ground. downloaded from: http:///
6/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings item symbol value unit power supply voltage v cc -0.3 to +7 (note 1) v output voltage 1 (pin no: pin no : 5-7, 9-14, 16-21, 23-28, 30-32) v ledmax -0.3 to +20 (note 1) v output voltage 2 (pin no: 34) v xerr -0.3 to vcc v input voltage (pin no: 1-3, 35-38, 41, 43-44, 48) v in -0.3 to vcc v power dissipation1 pd1 4.09 (note 2) w power dissipation2 pd2 5.20 (note 3) w operating temperature rang e topr -40 to +105 c storage temperature range tstg -55 to +150 c junction temperature tjmax 150 c drive current (dc) i omaxd 50 ma (note 1) pd should not be exceeded. (note 2) pd1 is decreased by 32.7mw/c for temperatures abov e ta=25c, mounted on 114.3mm x76.2mm x1.6mm glass-epoxy pcb. (note 3) pd2 is decreased by 41.6mw/c for temperatures abov e ta=25c, mounted on 114.3mm x76.2mm x1.6mm glass-epoxy pcb. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to 105c) item symbol min typ max unit power supply voltage v cc 3.0 3.3 5.5 v led maximum output current i max - - 50 ma application conditions (external constant range) parameters symbols min max unit vcc capacitor c vcc 1.0 - f vled capacitor c vled 10 - f iset resistor r iset 50 200 k xerr resistor r xerr 10 100 k ? downloaded from: http:///
7/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless specified, ta=-40 to 105c v cc =3.0 to 5.5v) parameter symbol min ty p max unit condition circuit current standby vcc circuit current i stb - 0.4 20 a reset state (all regi sters have default values) led terminal leak current is excluded vcc circuit current i vcc 2.7 5.0 ma all ch=on, pwm=100% i led =17.9ma setting, iset=56k ? (note1) led driver led current step iledstp 64 step current dac led maximum setup current i max - 50 - ma iset=50k ? (note2) led current accuracy i led -5 0 +5 % terminal voltage=1v, current accuracy of each out terminal i led =17.9ma setting, iset=56k ? (note1) led current matching i ledmt -5 0 +5 % an error with the average value of output current, terminal voltage=1v i led =17.9ma setting, iset=56k ? (note1) led current matching between rgb terminal i ledmt_rgb -5 0 +5 % terminal voltage=1v i led =17.9ma setting, iset=56k ? (note1) led current matching between devices i ledmt_dev -5 0 +5 % terminal voltage=1v i led =17.9ma setting, iset=56k ? (note1) line regulation ? i lin - - 2 %/v v cc from 3v to 5.5v load regulation ? i ro - - 1 %/v v out from 1v to 20v current linearity at pwm control i linpwm - - 1.5 % pwm duty over 3% led off leak current i lkl - - 3 a terminal voltage =20v iset terminal output voltage v iset - 0.96 - v iset resistance r iset 50 - 200 k ? osc osc frequency f osc 0.82 1.02 1.23 mhz pwm frequency f pwm 200 250 300 hz uvlo uvlo detection voltage v uvlofall 2.0 2.4 - v when power supply voltage falls uvlo release voltage v uvlorise - - 2.7 v when power supply voltage rises hysteresis voltage v uvlohys 50 - - mv protection function led terminal open detection voltage v lod - 0.2 0.3 v iset short detection resistance r isetsht 5.0 20 40 k ? (note1) at dac setting r: ad03, data=18h, dac setti ng g: ad04, data=18h, dac setting b: ad05, data=18h (r=56k ? : imax=40*64/56k ? =45.7ma) (note2) imax=40*64/50k ? =50ma downloaded from: http:///
8/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics - continued (unless specified, ta=-40 to 105c v cc =3.0 to 5.5v) parameter symbol min ty p max unit condition clk, sdi input l level voltage v ili1 -0.3 - 0.25 vcc v input h level voltage v ihi1 0.75 vcc - vcc +0.3 v input hysteresis voltage v hysi1 0.05 vcc - - v input current l ini1 -1 - 1 a input voltage= 3.3v sdo (cmos output pin) output l level voltage v olsdo - - 0.2 v i ol =1ma output h level voltage v ohsdo vcc -0.2 - - v i oh =1ma xerr (open drain output pin) output l level voltage v olxe - - 0.2 v i ol =1ma a0-5, oe (cmos input pin) input l level voltage v ili2 -0.3 - 0.25 vcc v input h level voltage v ihi2 0.75 vcc - vcc +0.3 v input hysteresis voltage v hysi2 0.05 vcc - - v input current l ini2 -1 - 1 a input voltage= 3.3v downloaded from: http:///
9/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves 5.5v 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -40 -15 10 35 60 85 110 v cc circuit current: i vcc [ma] ambient temperature: ta [ ] 1.0 1.5 2.0 2.5 3.0 3.5 4.0 3.0 3.5 4.0 4.5 5.0 5.5 v cc circuit current: i vcc [ma] supply voltage: v cc [v] figure 5. standby current (v cc characteristic) figure 6. standby current (temperature characteristic) figure 7. circuit current (v cc characteristic @ all outn=on pwm=100% iled=17.9ma iset=56k ) figure 8. circuit current (temperature characteristic @ all outn=on pwm=100% iled=17.9ma iset=56k ? ) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.0 3.5 4.0 4.5 5.0 5.5 v cc circuit current: i vcc [ a] supply voltage: v cc [v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -15 10 35 60 85 110 v cc circuit current: i vcc [ a] ambient temperature: ta [ ] 5.5v -40c 25c 105c 105c 25c -40c 3.0v 3.3v 3.3v 3.0v downloaded from: http:///
10/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued 0 10 20 30 40 50 06 41 2 81 9 22 5 6 led current: i led [ma] code: i ledstp [step] 17.0 17.2 17.4 17.6 17.8 18.0 18.2 18.4 18.6 3.0 3.5 4.0 4.5 5.0 5.5 led current: i led [ma] supply voltage: v cc [v] figure 9. led current (v cc characteristic @ iset=56k ? ) 17.0 17.2 17.4 17.6 17.8 18.0 18.2 18.4 18.6 -40 -15 10 35 60 85 110 led current: i led [ma] ambient temperature: ta [ ] figure 10. led current (temperature characteristic @ iset=56k ? ) 3.3v 3.0v 5.5v 0 10 20 30 40 50 0 1 63 24 86 4 led current: i led [ma] code: i ledstp [step] -40c 25c 105c figure 11. led current dac step (v cc =3.3v) 105c figure 12. led current pwm step (v cc =3.3v) -40 c 25c 25c -40c 105c downloaded from: http:///
11/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued 200 220 240 260 280 300 -40 -15 10 35 60 85 110 pwm frequency: f pwm [hz] ambient temperature: ta [ ] 0.7 0.8 0.9 1.0 1.1 1.2 -40 -15 10 35 60 85 110 osc frequency: f osc [mhz] ambient temperature: ta [ ] figure 14. pwm frequency (temperature characteristic) 3.0v figure 13. oscillation frequency (temperature characteristic) 5.5v 3.3v 5.5v 3.3v 3.0v downloaded from: http:///
12/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus format ? device address a7 a6 a5 a4 a3 a2 a1 a0 device control mode 0 1 a5 a4 a3 a2 a1 a0 bus control mode 0 0 * * * * * * device control mode: data is dependent on the a0 to a5 terminal settings. bus control mode: data can be received without being dependent on a0 to a5 terminal settings. ? start condition at startup, the device enters wait mode when 1 is written 16 times or more, and a device address is recognized after writing 0. ? ? write protocol data is shifted in the internal shift register on the rising edge clk. msb is entered first. the command format is: writing command 00 (2bit), device address (6bit), register address (8bit) and data (8bit). register address is incremented after the fourth byte automatically. device enters sleep state when 1 is written eight times. ? read protocol read from the next byte after register addres s write data for read data and device address. read data is output on the sdo pin. for a read command 8 clocks cycles are necessary. at the 8 th clock of last bit of the specified register address, it becomes sl eep state, and the sdo pin becomes l output. the last bit (d0) is outputted 7 clocks. a6 a5 a4 a3 a2 a1 a0 l sdo sdi clk d7 a7 d6 d5 ?? d0 l ?? 0 device address(dad) x x x x x x x data d7 d7 d7 d7 d7 d7 d7 d7 register address(rad) a 7 a 6 a 5 a 4 a 3 a 2 a 1 a 0 data d0 d0 d0 d0 d0 d0 d0 d6 d6 d6 d6 d6 d6 d6 d6 data x x x x x x x sdi clk ?? a6 a5 a4 a3 a2 a1 a0 a7 d6 d5 d4 d3 d2 d1 d0 d7 ?? h l 1 R 16 times d6 d5 d4 d3 d2 d1 d0 d7 h ?? ff 0 register address(rad) device address(dad) data d7 d6 d5 d4 d3 d2 d1 d0 a 7 a 6 a 5 a 4 a 3 a 2 a 1 a 0 x x x x x x x 1 1 1 R 16 data d7 d6 d5 d4 d3 d2 d1 d0 ff 1 1 1 1 1 1 1 1 sleep condition 8 clocks 7 clocks downloaded from: http:///
13/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 protocol sleep start standby receive device address receive device address data input 1 16 times in a row 1input 0 input input device address ff input input inexistent register address different device address 1) condition becomes start standby in any condition, if 1 is detected more than 16 times. for example, sleep condition starts if 1 is received 8 times while waiting for register address. moreover, the condition becomes start standby after receiving 1 8 times. ( 1) downloaded from: http:///
14/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 timing diagram clk sdi t ss t sh t wlc t whc t sp t sp sdo t dodl timing characteristics (ta=-40 to 105 c vcc=3.0 to 5.5v) item symbol standard value unit min typ max interface clk cycle time t scyc 100 - - ns clk cycle h period t whc 50 - - ns clk cycle l period t wlc 50 - - ns sdi setup time t ss 45 - - ns sdi hold time t sh 45 - - ns pulse width of spike removed by input filter of clk and sdi t sp 5 - - ns sdo output delay (cl = 1,000pf) t dodl - - 500 ns downloaded from: http:///
15/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 register map register address write or read register data function d7 d6 d5 d4 d3 d2 d1 d0 00h r - - a5 a4 a3 a2 a1 a0 device address 01h r - - - - - isetsh - ledopn error condition detection 02h w - - - - sftrst enmd md1 md0 mode setup 03h w - - dar5 dar4 dar3 dar2 dar1 da r0 dac setting for outrx terminal 04h w - - dag5 dag4 dag3 dag2 dag1 da g0 dac setting for outgx terminal 05h w - - dab5 dab4 dab3 dab2 dab1 dab0 dac setting for outbx terminal 06h w brr0(7) brr0(6) brr0(5) brr0(4) brr0(3) brr0(2) brr0(1) brr0(0) outr0 pwm setting 07h w brg0(7) brg0(6) brg0(5) brg0(4) brg0(3) brg0(2) brg0(1) brg0(0) outg0 pwm setting 08h w brb0(7) brb0(6) brb0(5) brb0(4) brb0(3) brb0(2) brb0(1) brb0(0) outb0 pwm setting 09h w brr1(7) brr1(6) brr1(5) brr1(4) brr1(3) brr1(2) brr1(1) brr1(0) outr1 pwm setting 0ah w brg1(7) brg1(6) brg1(5) brg1(4) brg1(3) brg1(2) brg1(1) brg1(0) ou tg1 pwm setting 0bh w brb1(7) brb1(6) brb1(5) brb1(4) brb1( 3) brb1(2) brb1(1) brb1(0) outb1 pwm setting 0ch w brr2(7) brr2(6) brr2(5) brr2(4) brr2 (3) brr2(2) brr2(1) brr2(0) outr2 pwm setting 0dh w brg2(7) brg2(6) brg2(5) brg2(4) brg2(3) brg2(2) brg2(1) brg2(0) outg 2 pwm setting 0eh w brb2(7) brb2(6) brb2(5) brb2(4) brb2( 3) brb2(2) brb2(1) brb2(0) outb2 pwm setting 0fh w brr3(7) brr3(6) brr3(5) brr3(4) brr3 (3) brr3(2) brr3(1) brr3(0) outr3 pwm setting 10h w brg3(7) brg3(6) brg3(5) brg3(4) brg3(3) brg3(2) brg3(1) brg3(0) outg3 pwm setting 11h w brb3(7) brb3(6) brb3(5) brb3(4) brb3( 3) brb3(2) brb3(1) brb3(0) outb3 pwm setting 12h w brr4(7) brr4(6) brr4(5) brr4(4) brr4(3) brr4(2) brr4(1) brr4(0) outr4 pwm setting 13h w brg4(7) brg4(6) brg4(5) brg4(4) brg4(3) brg4(2) brg4(1) brg4(0) outg4 pwm setting 14h w brb4(7) brb4(6) brb4(5) brb4(4) brb4(3) brb4(2) brb4(1) brb4(0) outb4 pwm setting 15h w brr5(7) brr5(6) brr5(5) brr5(4) brr5(3) brr5(2) brr5(1) brr5(0) outr5 pwm setting 16h w brg5(7) brg5(6) brg5(5) brg5(4) brg5(3) brg5(2) brg5(1) brg5(0) outg5 pwm setting 17h w brb5(7) brb5(6) brb5(5) brb5(4) brb5(3) brb5(2) brb5(1) brb5(0) outb5 pwm setting 18h w brr6(7) brr6(6) brr6(5) brr6(4) brr6(3) brr6(2) brr6(1) brr6(0) outr6 pwm setting 19h w brg6(7) brg6(6) brg6(5) brg6(4) brg6(3) brg6(2) brg6(1) brg6(0) outg6 pwm setting 1ah w brb6(7) brb6(6) brb6(5) brb6(4) brb6( 3) brb6(2) brb6(1) brb6(0) outb6 pwm setting 1bh w brr7(7) brr7(6) brr7(5) brr7(4) brr7 (3) brr7(2) brr7(1) brr7(0) outr7 pwm setting 1ch w brg7(7) brg7(6) brg7(5) brg7(4) brg7(3) brg7(2) brg7(1) brg7(0) outg 7 pwm setting 1dh w brb7(7) brb7(6) brb7(5) brb7(4) brb7( 3) brb7(2) brb7(1) brb7(0) outb7 pwm setting 1eh w - - - - - - - en brightness reflection (latch) assume that the input of -is 0. an undefined address may be assigned for test purposes . access to undefined register is prohibited. downloaded from: http:///
16/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 register description register address 00h < read device address> address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 00h r - - a5 a4 a3 a2 a1 a0 initial value (arbitrary) 0 0 0 0 0 0 0 0 bit [5: 0]: device address (read only) device address set by external terminal (a0 C a5) is returned. register address 01h address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 01h r - - - - - isetsh - ledopn initial value (arbitrary) 0 0 0 0 0 0 0 0 bit 2: isetsh iset terminal short detection 0: normal operation 1: iset terminal gnd short-circuit is detected bit 0: ledopn led open detect 0: normal operation 1: detect led open on any channel (at led is on, detect led terminal < 0.2v (typ)) downloaded from: http:///
17/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 register address 02h address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 02h w - - - - sftrst enmd md1 md0 initial value 00h 0 0 0 0 0 0 0 0 bit 3: sftrst soft reset 0: release reset 1: reset (auto return zero) sleep condition star ts after soft reset. bit 2: enmd enable mode 0: brightness register is latched on edge of en 1: ignore en (brightness regist er is updated immediately) bit [1: 0]: md(1: 0) mode setup 00: increment mode0 sleep after register address 1eh. example) 1ch 1dh 1eh sleep 01: increment mode1 return to 03h after register address 1eh. (round) example) 1ch 1dh 1eh 03h 04h ??? 10: increment mode2 return to 06h after register address 1eh. (round) example) 1ch 1dh 1eh 06h 07h ??? 11: prohibited command downloaded from: http:///
18/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 register address 03h-05h < write rgb dac setup> address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 03h w - - dacr5 dacr4 dacr3 dacr2 dacr1 dacr0 04h w - - dacg5 dacg4 dacg3 dacg2 dacg1 dacg0 05h w - - dacb5 dacb4 dacb3 dacb2 dacb1 dacb0 initial value 00h 0 0 0 0 0 0 0 0 dac (r, g, b) deserve for changing out (r, g, b) current. bit [5: 0]: rgb dac setup 000000: maximum led current 1/64 000001: maximum led current 2/64 000010: maximum led current 3/64 000011: maximum led current 4/64 000100: maximum led current 5/64 000101: maximum led current 6/64 000110: maximum led current 7/64 ? ? ? ? (maximum led current 1/64 step) ? ? 111000: maximum led current 57/64 111001: maximum led current 58/64 111010: maximum led current 59/64 111011: maximum led current 60/64 111100: maximum led current 61/64 111101: maximum led current 62/64 111110: maximum led current 63/64 111111: maximum led current 64/64 maximum led current : i led_max [ma] = 40 x 64 / r iset [k ? ] (typ) downloaded from: http:///
19/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 register address 06h-1dh address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 06h C 1dh w br**(7) br**(6) br**(5) br**(4) br**(3) br**(2) br**(1) br**(0) initial value 00h 0 0 0 0 0 0 0 0 bit [7: 0]: out** brightness setup 00000000 : pwm duty 0/512 led driver off setting (out terminal open detect function off) 00000001 : pwm duty 1/512 1/512 step setting 00000010 : pwm duty 2/512 1/512 step setting 00000011 : pwm duty 3/512 1/512 step setting ? ? ? ? (1/512 step) ? ? 01111101 : pwm duty 125/512 1/512 step setting 01111110 : pwm duty 126/512 1/512 step setting 01111111 : pwm duty 128/512 2/512 step setting 10000000 : pwm duty 130/512 2/512 step setting ? ? ? ? (2/512 step) ? ? 10111100 : pwm duty 250/512 2/512 step setting 10111101 : pwm duty 252/512 2/512 step setting 10111110 : pwm duty 256/512 4/512 step setting 10111111 : pwm duty 260/512 4/512 step setting 11000000 : pwm duty 264/512 4/512 step setting ? ? ? ? (4/512 step) ? ? 11111101 : pwm duty 508/512 4/512 step setting 11111110 : pwm duty 512/512 dc setting it is possible to control pwm brightness by individual channels. .% .% .% .% .% .% .% .% .% .% .% [duty] figure 15. register setup downloaded from: http:///
20/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 register address 1eh address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 1eh w - - - - - - - en initial value 00h 0 0 0 0 0 0 0 0 bit 0: en enable control 0: no reflect 1: reflect into output dat a of 03h to 1dh (auto return zero) however, this bit is ignored at enmd=1. downloaded from: http:///
21/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 timing diagram vcc vcc > 3. 0.1ms 10s to 1s vcc > 2. vcc > 1. hi_z vcc < 1.65v hi_z power on release por clk/sda vcc < 2.4v vcc < 3.0v hi_z hi_z uvlo release normal operation 0.1ms ref b12rst uvlo iled gate 10s to 1s figure 16. timing diagram the power supply rise and fall time should be in the range of 10 s to 1s. digital communication can only start 0.1ms after vcc exceeds 3v. always set the register volt age lower than vcc voltage. otherwise, when it is driven with more th an the vcc, led may flicker at the start. downloaded from: http:///
22/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 application example no. component name component value product name company 1 cvcc 1 f gcm188r71c105ka49 murata 2 riset 56k ? mcr03 series rohm 3 rxerr 10k ? mcr03 series rohm 4 cvled1 4.7 f gcm31cr71e475ka40 murata 5 cvled2 4.7 f gcm31cr71e475ka40 murata 6 cvled3 4.7 f gcm31cr71e475ka40 murata 7 routr0-7/routg0-7 /routb0-7 - esr25 series rohm figure 17. application circuit diagram bd2808muv micro- computer outg5 outr6 outb5 outb6 a4a3 outb7 vcc 3.0~5.5v vled (max=20v ) vcc xerr outg6 pgnd pgnd outr7 outg7 outr5 pgn d outb4 outg4 outr4 outb3 outg3 outr3 pgn d outb2 outg2 outr2 outb1 outg1 outr1 pgnd outb0 outg0 outr0 pgnd sdo a2 a1 a5 sdi test3 agnd clk test2 oe iset agnd vcc test1 a0 cvcc riset rxerr cvled1 3 fuse routr0-7 routg0-7 routb0-7 downloaded from: http:///
23/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 out pin and selection of external resistor (a) loss on out pin the led current is controlled by the driver. however to limit the power dissipation of the ic an external resi stor can be used. this resistor limits the vout seen by the ic, to reduce the power dissipation of the ic. the power dissipation of each channel is given by: there are 24 channels and w of total must be less than the power dissipation limit pd of the ic. then, the following expression holds true. / ? ? ? for correct operation the following expression must be satisfied ? ? ? from and , vout voltage must meet the following ranges / ??? ( if all 24 channels are active) when is not satisfied, a resistor is required between out pin and led of the ic to reduce the power dissipation of the ic by dropping the voltage seen by out pin. figure 19. out terminal limit voltage vf vbat out pgnd vled v1 m1 led ic iout vout r figure 18. out terminal output circuit diagram downloaded from: http:///
24/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 (b) out pin and gnd short when out pin is shorted to gnd, high current may flow vled to gnd through the led. it is recommended to insert a resistor in the path so that current can be restricted, si milar to that of figure 20. (c) constant resistance of out pin and setting of led voltage set the value of r by this formula: / if there is a maximum current, imax, then the resi stor value must meet the following equation: / / power dissipation figure 20. vqfn48mcv070 power dissipation note 1: power dissipation is calculated when mount ed on 114.3mm x 76.2mm x 1.6mm glass epoxy substrate. note 2 : connect the back exposure cooling body of package and board. board(1): 2 layer board (back copper foil 74.2mm 74.2mm) ja = 30.5 c/w pd = 2.13w (ta=85c) board(2): 4 layer board (2,3 cu layer, back copper foil 74.2mm 74.2mm) ja = 24.0 c/w pd = 2.71w (ta=85c) power dissipation changes with copper foil density of the board. this value represents only observed values, not guaranteed va lues. 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 25 50 75 100 125 150 power ? dissipation: ? pd ? [w] ambient ? temperature: ? ta ? [ ] (2) pd=5.20w (1) pd=4.09w downloaded from: http:///
25/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuits pin46(vcc) pin4,8,15,22,29,33 (pgnd), pin40,45(agnd) pin44(iset) pin1(a1),pin2(a2),pin35(a3), pin36(a4),pin37(a5),pin38(sdi) pin43(oe),pin41(clk),pin48(a0) pin3(sdo) pin34(xerr) pin5,9,12,16,19,23, 26,30 (outr[0:7]), pin6,10,13,17,20,24, 27,31(outg[0:7]), pin7,11,14,18,21,25, 28,32 (outb[0:7]) ( ) C pin name vcc vcc vcc vcc vcc vcc vcc downloaded from: http:///
26/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prev ent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external compon ents do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, an d routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a c apacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic duri ng assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
27/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connec ted to the gate of a mos transistor. t he gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outsi de can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unl ess otherwise specified, unused input pi ns should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adj acent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction o perates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lowe r than the gnd voltage to an input pin (and thus to the p subs trate) should be avoided. figure 21. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the c hange of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that t he output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automat ically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute ma ximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. nn p + p nn p + p substrate gnd n p + nn p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b bc e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
28/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 2 8 0 8 m u v - m e 2 part number package muv : vqfn48mcv070 packaging and forming specification m: high reliability e2: embossed tape and reel marking diagram v qfn48mcv070 ( top view ) bd2808 part number marking 1pin mark lot number downloaded from: http:///
29/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name vqfn48mcv070 downloaded from: http:///
30/30 datasheet d a t a s h e e t BD2808MUV-M tsz02201-0t3t0c500040-1-2 ? 2015 rohm co., ltd. all rights reserved. 4.jun.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 2014.12.12 001 new release 2015.06.04 002 page11 delete figure 13, 14 page23 add figure 19 downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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